| 摘要 |
<p>PURPOSE:To obtain the subject paste excellent in close-contacting property, adhesivity and stress characteristics and suitable for the mounting of a large- sized semiconductor chip by compounding an electrically conductive filler, an insulating filler, a silicone-modified polyimide resin and an organic solvent at specific ratios. CONSTITUTION:The objective paste can be produced by compounding (A) an electrically conductive filler, (B) an insulating filler, (C) a silicone-modified polyimide resin composed of an aromatic acid dianhydride, an aromatic diamine compound and a compound of formula (R1 is 1-5C bivalent aliphatic group, etc.; R2 and R3 are univalent aliphatic group, etc.; l is 1-100), etc., containing >=5wt.% of the silicone component and having an imidation degree of the imidatable silicone-modified polyamic acid of >=80wt.% and (D) an organic solvent at weight ratios A/(B+C) of 50/50 to 90/10, B/(A+C) of 0.1/99.9 to 49/51 and D/(A+B+C) of 0.01/100 to 50/100.</p> |
