| 摘要 |
PURPOSE: To decide an electromigration effect in a short time by allowing currents for testing to run in a structure for testing including a slim conductor in prescribed length, connecting wider conductors with the both ends of the conductor for testing, and specifying an inclination in a width direction. CONSTITUTION: A structure for testing includes a slim conductor 101 for testing, edge conductors 102 and 103 at least 5 times as wide as that are connected with the both edges, and currents are allowed to run from bond pads 104 and 105 to the conductor for testing. Probes for testing can be electrically brought into contact with the bond pads, and currents are allowed to run from a current source outside an integrated circuit wafer in which the structure for testing is formed. Length L of the conductor 101 for testing is set 50 micron. Thus, a uniform and relatively loose thermal slope can be obtained. Also, inclination is defined at the side part of an inclined area narrowed from the wider edge areas to the conductor area 101 for testing, and about 45 deg. is the most desirable in a range from 30 deg. to 60 deg.. |
