| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered wiring board with an insulating layer, wherein the wiring board can be kept high in heat resistance and insulation reliability, when it is moistened, and a fine via hole can be provided thereto. SOLUTION: An insulating layer 3 is formed on the circuit surface of an insulating board 1 where a first circuit 2 is formed, a via hole 6 is provided to the insulating layer 3 so as to be connected to the first circuit 2, a second circuit 8 is formed on the surface of the insulating layer 3 by a copper plating. The inter-layer connection of the via hole 6 is made through copper plating for the formation of a multilayered wiring board, wherein the insulating layer is formed of photosensitive resin which contains dihydric phenol or trihydric phenol as an integral component or insulating resin which is concurrently photosensitive and thermosetting. |
