| 摘要 |
<p>A polyolefin resin composition comprising a linear ethylene (co)polymer having a density (d) of 0.86 to 0.97 g/cm3, a melt flow rate (MFR) of 0.01 to 100 g/10 min, and a molecular weight distribution (M¿w?/Mn) of 1.5 to 5.0 and an epoxy compound containing two or more epoxy groups per molecule and having a molecular weight of 3,000 or lower. The composition has a wide molding temperature range and can give a laminate having high adhesion strength at a high molding speed.</p> |
