MANUFACTURING METHOD AND APPARATUS OF THICK-FILM CONDUCTIVE CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To realize a mass production manufacturing step of a thick-film con ductive circuit board which is suitable for a non contact ID card and the like. SOLUTION: While a resin film base 2 is carried continuously from an unwinding apparatus 3 to a winding apparatus 8, an electron beam curing conductive paste 5 is printed on the resin film 2 by a rotary screen printer 4, to from a thick-film conducting circuit pattern. The thick-film conductive circuit pattern is irradiated with an electron beam and cured by an electron beam irradiation apparatus 6.