| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component by which the assembling processes can be simplified, assembling cost can be reduced, high yield can be maintained and connection reliability can be assured by employing a flip-chip connection method without having to use a conductive adhesive, in a method for manufacturing a flip-chip connection structure in which a semiconductor integrated circuit chip is mounted directly on a circuit board. SOLUTION: Electrodes of the semiconductor integrated circuit chip are abutted on electrodes of the circuit board, the electrodes of both sides are connected through a solid-phase diffusion, thereby forming a flip-chip structure in which resin is used between the electrodes of the semiconductor integrated circuit chip and the electrodes of the circuit board.
|
