| 摘要 |
The invention relates to an integrated electric circuit comprising a metal layer provided with a passivation layer. The passivation layer is made of a monomolecular film which is placed on the surface of the metal layer. The monomolecular film is formed prior to contacting the metal layer with metal wires. The wires are pushed through the passivation layer with a force strong enough to pierce the monomolecular film. In the alternative, the film may be selectively removed at defined locations in preparation for the contacting with the wires.
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