COOLING CHAMBER FOR CVD EQUIPMENT

摘要

PURPOSE: A cooling chamber for CVD(Chemical Vapor Deposition) equipment is provided to cool rapidly a wafer by improving a structure of the cooling chamber. CONSTITUTION: A lid(30) is used for sealing an upper side of a chamber(20). A gas inflow line(40) is installed at the lid(30). A control valve(40) is installed at an intermediate portion of the gas inflow line(40) in order to control the amount of gas. Nitrogen gas is used as the gas. An entrance portion is installed at one side of the chamber(20) in order to load a wafer. A work space(22) is formed in the inside of the chamber(20). The work space(22) of the chamber(20) is connected with the gas inflow line(40). The work space(22) has a shape of lozenge in order to reduce a loss of the gas received through the gas inflow line(40). A wager loading plate(50) is installed at a center of the space work(22). A cooling water line(10) is installed at the wafer loading plate(50). An exhaust gas line(60) is installed at a lower portion of the chamber(20). A control valve(62) is installed at the exhaust gas line(60) in order to control the amount of exhaust gas. A net(64) is installed at a junction part between the exhaust gas line(60) and the chamber(20).