| 发明名称 |
CIRCUIT BOARD, SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING CIRCUIT BOARD |
| 摘要 |
PROBLEM TO BE SOLVED: To enhance bonding accuracy to a lead electrode while dealing with the trend of narrower pitch of the lead electrodes. SOLUTION: A film substrate 1 is provided with a lead electrode 2 having a sharpened bonding face and a salient electrode 4 is bonded to the lead electrode 2 with the bonding face of the lead electrode 2 biting into the salient electrode 4. COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2004363177(A) |
申请公布日期 |
2004.12.24 |
| 申请号 |
JP20030156848 |
申请日期 |
2003.06.02 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
NISHIOMOTE MUNEHIDE |
| 分类号 |
H01L21/60;H01L23/498;H05K3/06;H05K3/12;H05K3/24;H05K3/40;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
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