发明名称 METHOD FOR MANUFACTURING SUBSTRATE WITH RESIST FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To improve uniformity of film thickness of a resist film made of applied resist agent by reducing distribution of film thickness of an applied film when it is applied with an application apparatus named 'CAP coater'. <P>SOLUTION: A resist agent 21 is made contact with a surface 10a to be applied through the top end of an application nozzle 22 and then a space G between the top end of the application nozzle 22 and the surface 10a is kept within the range less than a liquid separation distance in which the resist agent 21 in contact with the surface 10a just separates from the surface 10a and 50% or more of the distance. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005051220(A) 申请公布日期 2005.02.24
申请号 JP20040200516 申请日期 2004.07.07
申请人 HOYA CORP 发明人 MOTOMURA SHUHO
分类号 B05C5/02;B05D1/26;G02F1/13;G03F1/50;G03F1/82;G03F7/16;H01L21/027;(IPC1-7):H01L21/027;G03F1/14 主分类号 B05C5/02
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