| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that temperature variation in the wafer surface is significant during a transient period immediately after a wafer is replaced on a planar ceramic body in a wafer heater before the temperature is settled. SOLUTION: The wafer supporting member provided, on one major surface of a planar ceramic body, with a resistive heating element and, on the other major surface thereof, with a wafer mounting surface comprises a section for supplying power to the resistive heating element, and a metal case surrounding the power supply section. The resistive heating element located at the outer circumferential part of the planar ceramic body has a concentric pattern, the mounting surface is protruding and the circumcircle of the resistive heating element has a diameter of 90-99% that of the planar ceramic body. COPYRIGHT: (C)2005,JPO&NCIPI |
