| 摘要 |
PROBLEM TO BE SOLVED: To provide a suction transport device which eliminates the variations of the distributed suction and can stably suck a thin plate material like a semiconductor wafer to transport. SOLUTION: The suction material 17 is composed of a nearly disk-like suction pad 25 having a surface matching flat surface of the semiconductor wafer W and a disk support 26 for supporting the suction pad. Inside the surface of the support, the device has an interior air chamber 35 and an exterior air chamber 36 which are continuously connected to a pressure reduction unit formed inside a robot main part 15 in which the suction material 17 is attached, and connection path 37 which connects them with each other continuously. The interior air chamber and the exterior air chamber are formed on a nearly concentric circle along a nearly closed loop-like locus. COPYRIGHT: (C)2005,JPO&NCIPI |
