STACK TYPE SEMICONDUCTOR DEVICE HAVE A COOLING PATH ON THE BACKSIDE

摘要

A stack type semiconductor device having a cooling path is provided to cool the heat generated from a semiconductor chip through the cooling path, and to prevent a warpage problem by joining the bottom surfaces of semiconductor chips each other. A first and a second semiconductor chips(100,200) are joined facing a second surface each other. A circular type third cooling path(310) is formed at the center portion of the stack type semiconductor device(300) by a first cooling path within the first semiconductor chip and a second cooling path within the second semiconductor chip. If the stack type semiconductor device is installed within an electronic products having a cooling pan, a cooling air can be flowed directly through third cooling path. Thus, when operating the stack type semiconductor, the heat can be exhausted efficiently to the outside.