| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, providing an electronic component device having excellent solder heat resistance, moisture-resistant reliability and high-temperature preservation characteristics. <P>SOLUTION: The epoxy resin composition for sealing contains (A) a crystalline epoxy resin, (B) a phenol resin-based curing agent, (C) a curing accelerator and (D) an inorganic filler containing an active alumina (d1) which is regulated so as to contain≥0.1 ppm and≤1,500 ppm sodium. Preferably, the active alumina (d1) is a porous alumina produced by firing the aluminum hydroxide produced by a Bayer method or an underwater discharge method, and has≥30 m<SP>2</SP>/g and≤400 m<SP>2</SP>/g average specific surface area, and the content of the active alumina is≥0.01 wt.% and≤5 wt.% based on the whole epoxy resin composition. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
