| 摘要 |
PURPOSE:To maintain existing advantages as they are and further to cause a hybrid integrated circuit device to correspond to multiple pins and adapt the device for high density mounting by shaping the tip of an external terminal into an L-shape and by equipping a pawl part to be inserted into a hole provided in a mother board for mounting the hybrid integrated circuit device. CONSTITUTION:A thick-film hybrid integrated circuit substrate 1 is installed with two rows of L-shaped clip terminals 2 with 1.8mm pitch in such manner that said clip terminals are taken out alternately in opposite directions, and covered with a sheathing material 3. The leads of clip terminals 2 taken out perpendicularly to the substrate 1 are cut to about 1mm in the manner of forming flat lead parts except those of the terminals on both sides. Further, the leads on both sides are of about 5mm length and bent in the manner of forming pawl parts 6, the tips of which are inserted into the insertion hole 5 of a mother board 4. When a hybrid integrated circuit device is connected with the mother board 4, a soldering paste is applied to the position on the mother board 4 corresponding to the flat lead parts and said hybrid integrated circuit device is mounted and solder-joined by a paper phase reflow method. |
