| 摘要 |
<p>PURPOSE:To realize good soldering of a surface package part and to promote high density without using solder resist in a multilayer printed board. CONSTITUTION:Two or more wiring layers (A, B, C, D) are laminated on a printed board, and a through-hole 14 is shaped in the laminated body and conductive plating 24 is applied thereto. Thermosetting resin 26 is filled in the through- hole 14 of the printed board, and conductive plating 30 is attached to a surface of the filled through--hole part.</p> |
