| 摘要 |
PURPOSE:To provide a semiconductor module which is provided with a plurality of semiconductor chips and can mount the semiconductor chips at a high density. CONSTITUTION:This semiconductor module is constituted by constituting each vertically mounting type semiconductor chip 1 by arranging semiconductor chip lead patterns 3 for input-output on one edge section of a chip main body section 2 in a limited state and, at the same time, input-output terminals 4 provided in corresponding to the lead patterns 3 in the extent of the thickness T of the chip main body section 2 and mounting a printed board 15 constituted by arranging the semiconductor chips 1 in parallel on a base substrate 20 in an overlapping state. |
