| 摘要 |
PURPOSE:To improve the manufacturing yield in a resin-molding process in the manufacture of a resin molded-type semiconductor device. CONSTITUTION:In a plastic package formed when a TAB tape is cut in the blank region of the tape after a semiconductor IC is bonded to the TAB tape and an IC-mounted lead frame is resin-molded after a plurality of leads existing in the blank region are aligned with and bonded to the lead frame, the manufacture of a semiconductor device is characterized by cutting the TAB tape beforehand in the blank region of the tape and bonding the tape to the lead frame and thereafter by bonding the semiconductor IC to the TAB tape and resin- molding them. |
