| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device for the purpose of easily discriminating whether the adhesive sheet is present, even when the adhesive sheet is thinly layered, thereby reducing a downtime of manufacturing equipment and improving a yield, and furthermore, to provide a method of manufacturing a semiconductor device using the adhesive sheet. <P>SOLUTION: The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device which is intended to adhere a semiconductor device to an adhesion-target body and is characterized in that it contains pigment which absorbs or reflects light in a wavelength region ranging from 290 nm to 450 nm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
