发明名称 LAMINATED CHIP TYPE PARTS AND ITS MANUFACTURE
摘要 PURPOSE:To enable electrical connection between conductive patterns which are formed for each layer to be performed positively by allowing a conductive part for connection to be in contact with and fixed at other conductive parts for connection at areas other than a through-hole. CONSTITUTION:In an insulation layer 10, a main body of parts of an inductor l is formed in one piece in lamination. A conductive pattern 11 is formed at a plurality of insulation layers. A through-hole 12 is formed by irradiation of laser penetrating a specified insulation layer portion including a position where the conductive pattern 11 is formed and a layer position of the insulation layer which is away from the conductive pattern 11. A conductive part for connection 13 is buried into a hole of the through-hole 12 and is exposed outside the hole and hence is in contact with and fixed with others. Conductive parts 13 and 23 for connection are lead out onto a lower surface of an upper surface of the parts main bodies 1 and 2 through the through-holes 12 and 22 which are provided at other insulation layers 10 and 20, thus enabling an area between edges to be in contact and fixed. Therefore, the conductive part for connection can be mechanically in contact and fixed, thus achieving electrical connection positively.
申请公布号 JPH04242908(A) 申请公布日期 1992.08.31
申请号 JP19900416147 申请日期 1990.12.29
申请人 TDK CORP 发明人 TAKAHASHI TETSUO;YOSHIDA MASAYUKI;SASAKI TOSHIYUKI
分类号 H01F27/00;H01F17/00;H01F41/04;H01G4/30;H01G4/40;H01G13/00;H05K3/46 主分类号 H01F27/00
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