Article and panel comprising semiconductor chips, casting mold and methods of producing the same

摘要

A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one semiconductor chip having a front, a rear and edge sides provided per semiconductor device position. The reconfigured wafer includes: a front side that forms a coplanar area with the front sides of the at least one semiconductor chip and a plastic housing composition embedding the edge sides and the rear side of the at least one semiconductor chip. The reconfigured wafer includes, on a rear side of the wafer, structures configured to stabilize the panel. The structures are composed of the plastic housing composition and are formed as thickenings of the reconfigured wafer.

主权项

1. A panel comprising:
a plastic housing composition; wherein the plastic housing composition comprises a front side and a rear side; and wherein the rear side comprises at least one projecting structure thereon; and wherein the thickness of the at least one projecting structure ranges from 50 μm to about 200 μm; and wherein the remainder of the panel excluding the at least one projecting structure has a thickness ranging from 30 μm to about 100 μm; and at least two semiconductor chips having a front side, a rear side, and at least one edge side; and wherein the rear side and the at least one edge side of the at least two semiconductor chips are embedded in the plastic housing composition.