Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

摘要

Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can include a first known good packaged microelectronic device including a first interposer substrate. A first die and a first through-casing interconnects are electrically coupled to the first interposer substrate. A first casing at least partially encapsulates the first device such that a portion of each first interconnect is accessible at a top portion of the first casing. A second known good packaged microelectronic device is coupled to the first device in a stacked configuration. The second device can include a second interposer substrate having a plurality of second interposer pads and a second die electrically coupled to the second interposer substrate. The exposed portions of the first interconnects are electrically coupled to corresponding second interposer pads.

主权项

1. A method for manufacturing a stacked microelectronic device, the method comprising:
positioning a first known good packaged microelectronic device proximate to a second known good packaged microelectronic device, the first device including a first interposer substrate with a first side and a second side, wherein the first side includes a plurality of first interposer contacts, a first die electrically coupled to the first interposer contacts via a plurality of wire bonds, and a plurality of electrically conductive interconnects electrically coupled to the first interposer substrate, wherein the electrically conductive interconnects comprise a plurality of filaments attached to and projecting from corresponding first interposer contacts, wherein each of the plurality of wire-bonds physically contacts a corresponding one of the plurality of electrically conductive interconnects, and wherein the first die, at least a portion of the first interposer substrate, and at least a portion of the plurality of electrically conductive interconnects are encased in a first casing, and further wherein the filaments have a height greater than or equal to a thickness of the first casing such that a portion of each filament is accessible at a top portion of the first casing, wherein the second side of the first interposer substrate includes a first pad and a second pad, wherein a conductive trace electrically couples the first pad to the second pad, and wherein the second pad is positioned inboard of the first pad and is configured to be attached to an electrical coupler such that the electrical coupler attached to the second pad is positioned inboard of the first pad and is electrically coupled to the first pad by the conductive trace; and mounting the second device to the first device in a stacked configuration with an adhesive material that couples a second side of a second interposer substrate of the second device to an upper surface of the first casing of the first device, the second device including a second die electrically coupled to the second interposer substrate and a second casing covering the second die and at least a portion of the second interposer substrate, wherein the accessible portions of the filaments at the top portion of the first casing are electrically coupled to corresponding interposer pads of the second interposer substrate.