| 摘要 |
PURPOSE:To prevent wire breakdown, separation of a pellet and the like even at time a semiconductor device is intensely vibrated, by mounting or embedding a holding member having a specified shape on or in a coating material. CONSTITUTION:In a silicon gel 12, a net 13 comprising a metal, e.g., 42 alloy, which is a holding member bent and formed in a specified form, is embedded. The net 13 is fixed at the same time a cap 4 is attached by a bonding agent 5 at the peripheral part of the net. The peripheral part of the net 13 is fixed in this way and the inside of the net is embedded in the silicon gel 12. Therefore, the silicon gel can be held at the specified position. Even if the semiconductor device is placed in an intensely vibrating state, occurrence of breakdown of a wire 10 and the like caused by vibration and separation of the silicon gel can be prevented. Since the periphery of the net 13 is contacted with the bonding agent 5 having heat conductivity, heat generated in the pellet at the time of operation can be conducted to the cap 4 through the net 13. Thus efficient heat radiation can be achieved. |
