| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves a small temperature difference on a semiconductor substrate between a point where a power element is located and a point where a heat sensitive element is located.SOLUTION: A semiconductor device comprises a power element and a heat sensitive element which are arranged on the same semiconductor substrate. In the heat sensitive element, one of PN junction is connected to either of ground potential VSS or power supply potential VDD via a resistive element, and a sum of a potential difference between both ends of the PN junction and a potential difference between both ends of the resistive element is used as a signal of temperature detection. By doing this, latch-up is avoided and the heat sensitive element can be arranged in a dent provided on the power element.SELECTED DRAWING: Figure 1 |
