COPPER POWDER, AND COPPER PASTE, CONDUCTIVE COATING AND CONDUCTIVE SHEET USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper powder capable of suitably being used as applications such as a conductive paste or an electromagnetic wave-shielding while maintaining excellent conductivity by increasing contacts of copper powder each other.SOLUTION: The copper powder is a copper powder 1 having a shape of an aggregate by aggregating a plurality of copper particles with divided piece shape 2 and the copper particles 2 each have a flat sheet shape having average major axis diameter d of 0.5 μm to 5 μm and cross section average length of 0.02 μm to 0.5 μm measured by a scanning electron microscopy (SEM) observation and average particle diameter (D50) measured by a laser diffraction scattering type particle size distribution measurement method of the copper powder 1 of 1.0 μm to 30 μm.SELECTED DRAWING: Figure 1