发明名称 COMPOSITION FOR FORMING CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN USING SAME, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN
摘要 The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
申请公布号 EP2958112(A4) 申请公布日期 2016.09.07
申请号 EP20140787383 申请日期 2014.04.17
申请人 LG CHEM, LTD. 发明人 PARK, CHEE SUNG;PARK, CHEOL HEE;JUN, SHIN HEE;JUNG, SANG YUN;JEONG, HAN NAH
分类号 H01B1/22;C08J7/12;C08K3/22;C08L69/00;C23C18/16;C23C18/18;H01B13/00;H05K3/10;H05K3/18 主分类号 H01B1/22
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