| 摘要 |
<p>PURPOSE:To take out wafers surely from a wafer carrier even if the said carrier has deformed. CONSTITUTION:In a wafer carrying device which takes out a desired semiconductor wafer 1 from inside a wafer carrier 2 by inserting a suction arm into a wafer carrier 2 put on a stage and moving it back, the above-mentioned stage is provided with supporting pins 5 for supporting a wafer put at the lowest position in the wafer carrier 2, and space for inserting the above-mentioned suction arm is secured between a cross bar made at the bottom of the wafer carrier 2 and the above-mentioned lowest wafer by the above-mentioned supporting pins 5, when the wafer carrier 2 is put on the above-mentioned stage.</p> |
