| 摘要 |
<p>PURPOSE:To provide a method of manufacturing a hybrid integrated circuit comprising a small size and simplified external lead structure. CONSTITUTION:A circuit pattern schematically expressed by a die bond pad (26) and a bonding pad (28) is formed by etching a copper foil adhered to an insulated metal substrate forming a slit (16) into a predetermined pattern and a lead shaped conductive path (24) is formed to traverse the slit (16) from such circuit pattern. After exposing the lead shaped conductive path (24) by selectively irradiating an insulating resin layer under the lead shaped conductive path (24) with an excimer laser, an external lead integrated with the circuit pattern is formed by cutting the bridge part of the slit (16). Since the external lead structure is simplified, not only it may be arranged within a fine space but also the occupied area of the external lead pad is reduced, improving the integration density.</p> |
