| 摘要 |
958,241. Semi-conductor devices. TEXAS INSTRUMENTS Inc. May 6, 1960 [May 6, 1959], No. 16070/60. Heading H1K. A semi-conductor body, e.g. of germanium, silicon or intermetallic alloys is attached to an insulating, e.g. ceramic base by a cement, the thermal expansion coefficient of which matches those of the ceramic and semi-conductor. The wafer is then processed and a sealed enclosure, of which the substrate forms an external wall, formed around it. In one embodiment a semiconductor wafer in ohmic contact with metal strip or silver paste electrodes 3-6 (Fig. 1), on a ceramic base 1 is stuck to the base with a thermosetting cement, containing finely-divided glass, and is subsequently formed into a junction diode combined with a centre-tapped resistor, constituted by the semi-conductor wafer itself. A metal ring 11 (Fig. 2), coated with non-conductive glaze 12, or a ceramic ring metallized on its upper surface, is mounted on a low-melting glaze ring 13 applied over electrodes 3-7 and sealed thereto by heating to soften the glaze. Metal plate 14 is subsequently welded or soldered to ring 11 in inert gas or vacuo to form a sealed housing. A multivibrator formed from a single slab of semiconductor and of the circuit configuration shown in Fig. 4, is made by the following steps. A sheet of nickel-iron-cobalt alloy is etched to the form shown in Fig. 5 with indexing holes 53, 54. The sheet is positioned by these holes, a semi-conductor wafer ohisically soldered thereto in the position shown, and the assembly attached to a ceramic base as described above. The wafer is then subjected to various processes as described in Specification 945,734, to form therein the elements of the multivibrator circuit and to interconnect them. A housing is formed about the processed wafer broadly as described with reference to Fig. 2, but using a basically rectangular ring 52. The alloy sheet is finally cut along the dotted lines to isolate the various external connections of the circuit. |
