发明名称 MANUFACTURE OF WIRING BOARD
摘要 PURPOSE:To make smooth the surface of a wiring pattern formed by screen print. CONSTITUTION:In a wiring board manufacturing method which prepares a wiring board by forming a wiring pattern 12 on a board 11 by screen print, there is provided a process which allows a wiring board 21B where the wiring pattern 12B is formed on the board 11 by screen print, to pass through rollers 22, and levels the printed wiring pattern 12 by the extrusion force between the rollers 22. This process makes it possible to smooth the surface of the wiring pattern 12 so as to obtain a wiring pattern whose surface is smooth.
申请公布号 JPH04273139(A) 申请公布日期 1992.09.29
申请号 JP19910033226 申请日期 1991.02.27
申请人 SONY CORP 发明人 HORI TAKESHI
分类号 H01L21/12;H01L21/60;H01L23/12;H05K3/12;H05K3/22 主分类号 H01L21/12
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