| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which satisfies high reliability even when cured at a low temperature. <P>SOLUTION: The positive photosensitive resin composition comprises an alkali-soluble resin (A) having at least a polybenzoxazole precursor structure, a photosensitizing agent (B), and a cyclic compound (C) having an alcoholic hydroxyl group. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2009047943(A) |
申请公布日期 |
2009.03.05 |
| 申请号 |
JP20070214227 |
申请日期 |
2007.08.21 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
MAKABE HIROAKI |
| 分类号 |
G03F7/023;G03F7/004;H01L21/027 |
主分类号 |
G03F7/023 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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