| 摘要 |
PURPOSE:To provide a method of positioning a wafer capable of positioning with good precision even when a nonlinear strain is caused in a part of a chip array on the wafer and of enhancing the manufacturing yield of LSIs, etc. CONSTITUTION:In a method of projection-exposure in which the coordinates of a plurality of chips on a wafer are measured with empolyment of a step-and- repeat projection aligner and in which a reticle pattern is positioned at a desired location by interpolating and extrapolating the coordinates of all chips, the coordinates of a chip are determined by interpolating and extrapolating from the measured coordinates of the other chips in a row or a column including the chip. |
