| 摘要 |
PURPOSE:To obtain the title composition useful for sealing machines, etc., having low modulus of elasticity, small coefficient of linear expansion, low water vapor absorption and excellent fluidity, comprising a specific nephthalene ring- containing epoxy resin, a phenol resin and an inorganic filler. CONSTITUTION:The objective composition comprising (A) a nephthalene ring- containing epoxy resin shown by formula I (E is group shown by formula II; R<1> is H or 1-6C monofunctional hydrocarbon; n is 0-5) and formula III (E is group shown by formula II; R<0> is H or group shown by formula II), (B) a phenol resin such as phenol novolak resin and (C) an inorganic filler such as fused silica [the amount of the filter used is preferably 200-700 pts.wt. based on 100 pts.wt. total amount of the components A and B] as essential components. A semiconductor device sealed with a cured material of the composition has high reliability in thermal shock in surface packing. |
