| 摘要 |
<p>PURPOSE:To provide a manufacturing apparatus for a semiconductor device which is capable of reducing the time required for the evacuation and restoration to the ambient pressure during the manufacturing process of a semiconductor device where vacuum processing of a wafer is required. CONSTITUTION:A cassette 2 with a closure 7, which can carry a wafer in an evacuated state, is inserted into the main unit 3 of a semiconductor manufacturing system through a cassette insert port 11 thereof. An opening/closing mechanism 9 for use with the closure of the cassette is hermetically sealed and evacuated, and the wafer 1 then undergoes processes with the closure 7 open. After the completion of the processes, air is introduced into the opening/closing mechanism 9 with the closure 7 closed, and the cassette 2 is transported. Thus, this arrangement requires only the evacuation of the closing/opening mechanism 9, so that the amount of dust attached to the wafer is reduced, since the wafer 1 is not exposed to the outside air.</p> |
