| 摘要 |
PURPOSE:To achieve that the height of bumps which are formed on the element formation face of a semiconductor wafer or on a lead wire by a TAB technique is made uniform within a definite range. CONSTITUTION:Bumps 2 are heated to a reflow state; parts protruding at the prescribed height or higher of the bumps 2 are made to adhere to the low- temperature surface of revolving roller 8 and are removed. When a semiconductor chip is mounted, it is possible to reduce the probability that a bonding defect is caused. A semiconductor chip which has been thrown away as a defective product due to an irregularity in the height of the bumps 2 in conventional cases can be used as a nondefective product. |
