发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To join a metallic wire and an inner lead completely by efficiently removing a coating material immediately before bonding when bonding is conducted by using a coated wire, in which the periphery of the metallic wire is coated with an insualtor. CONSTITUTION:When second bonding is conducted to an inner lead 6, a capillary 1 is lowered to a position B separate from a specified bonding position A, a coated wire and the inner lead 6 are brought into contact, a coating material is removed by performing scrubbing operation, and the capillary 1 is moved to a specified bonding position A, thus completing bonding.
申请公布号 JPH04318942(A) 申请公布日期 1992.11.10
申请号 JP19910085637 申请日期 1991.04.18
申请人 NEC CORP 发明人 MATSUKURA TAKUMI
分类号 H01L21/60 主分类号 H01L21/60
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