| 摘要 |
PURPOSE: To provide a technology for precisely matching a laser, a detector, a lens, the optical element of a waveguide and the like with a package substrate. CONSTITUTION: A capacitance of arrays of plates, arranged on an opto-electronic device chip 10 and a package substrate 12 is measured. Then, phase-sensing is detected for sensing an entire current which is capacitively connected to a passive plate 14 of the device chip 10 from the two overlapped plates 16 and 18 arranged on the package substrate 12. When the device chip 10 is appropriately matched with the package substrate 12, the total current sensed by a third overlap plate 22 of the package substrate 12 becomes zero. |
