| 摘要 |
In manufacturing a support such as a lead frame for a semiconductor device, alloying material such as gold is selectively applied in sufficient thickness for the device bonding operation to a part only of a supporting member of the support, by impacting an initially-spherical particle of the alloying material onto the selected part by an impacting tool, for example, forming a thermocompression bond, the particle being secured on the selected part either, when of spherical shape, initially by slight impacting under a suction tool, or, after being flattened between a heated, polished surface of the impacting tool and a polished anvil, solely by the impacting tool. |
