METHOD AND APPARATUS FOR INSPECTING SOLDERED PART

摘要

PURPOSE:To inspect the quality of the bonded state of the soldered part present on the surface of a circuit board with high resolving power by an aperture synthesizing system. CONSTITUTION:A transducer 1 allows pulselike ultrasonic waves to radially propagate through a circuit board 2 and detects the ultrasonic waves reflected from the surface of the board where soldered part 3 is present. The scattering wave component of the detection data is extracted in a regular reflection cut-off part 14 and, after the direction dependence of the intensity of scattering waves is corrected in a reflectivity calculating part 15, aperture synthesizing processing is performed in an image reconstitution part 17 and the two-dimensional image of the reflection intensity of ultrasonic waves at a soldered bonded interface is detected. A flaw judging part 19 judges the flaw of the soldered part on the basis of said image.