发明名称 SOLDER COATING DEVICE
摘要 PURPOSE:To form uniformly a solder having a substantial thickness on the surface of a circuit board by providing a pair of coating rollers apart from each other in such a manner that the rollers are partly dipped in solder liquid, providing feed rollers right above the coating rollers and providing a solder feed nozzle between the coating rollers. CONSTITUTION:The 1st and 2nd coating rollers 7, 8 are mounted apart at an inter-axis space L in such a manner that the rollers are dipped by about 2/3-3/4 into he solder liquid 2 in a solder tank 1 and the solder liquid feed nozzle 10 is provided between the two rollers 7, 9 relative to a passing line 6. The 1st and 2nd feed rollers 14, 16 with the line 6 in-between are provided right above the rollers 7, 8 and are made vertically finely adjustable by means of adjusting screw devices 15, 17. The roller 14 is preferably made of soft rubber and the roller 16 of hard rubber. A prime moving sprocket 19 is driven in this state to revolve the rollers 7, 8, 14, 16 and the printed board 5 is passed along the line 6 so that the solder liquid 2 is stuck on the pattern surface thereof by the rollers 7,8 and the nozzle 10.
申请公布号 JPS611467(A) 申请公布日期 1986.01.07
申请号 JP19840120496 申请日期 1984.06.12
申请人 HOOPU SEIKI KK 发明人 ABE KAZUO;OKUYAMA HIROO;HIDO TADASHI
分类号 H05K3/24;B23K1/08;B23K3/06;H05K3/34 主分类号 H05K3/24
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