发明名称 PIPE CONNECTING DEVICE FOR SILICON WAFER THROUGH HOLE
摘要 PURPOSE:To connect a pipe with a silicon wafer completely by providing a connection fixing member nearby atop of the pipe when the silicon wafer through hole and pipe are connected mutually, and pressing the member and connecting the both. CONSTITUTION:The silicon wafer 2 is brought into contact with a glass plate 1. The tip of the pipe 3 is joined with the through hole 2a of the wafer 2 and the fixing member 4 for connection, e.g. heat-resisting rubber is wound around the pipe near its tip. A packing 7 is provided onto the fixing member 4, and the fixing member 4 is pressed with an aluminum-made reinforcing plate 5 to connect the pipe 3 and silicon wafer 2 fixedly to each other. Thus, the pipe and silicon wafer are connected by the connection fixing member, so the leak of gas and liquid from the connection part is prevented completely and the pipe is also detachable form the silicon wafer.
申请公布号 JPS61155857(A) 申请公布日期 1986.07.15
申请号 JP19840275359 申请日期 1984.12.28
申请人 SORD COMPUT CORP 发明人 YANO EIICHI
分类号 G01N30/26;B01D15/08;G01N30/60;G01N37/00 主分类号 G01N30/26
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