发明名称 AQUEOUS POLYIMIDE RESIN COMPOSITION
摘要 PURPOSE:To provide the titled compsn. having excellent resistance to heat and impact, etc., consisting of a polyimide, water and ammonia. CONSTITUTION:An acid component consisting it at least 50mol% of 3,4- dicarboxy-1,2,3,4-tetrahydronaphthalene-1-succinic acid (di-anhydride) and not more than 50mol% of other polybasic acid (e.g. pyromellitic acid) and a primary diamine (e.g. m-phenylenediamine) are subjected to amidation and imidation reactions in the presence or absence of a solvent (e.g. butyl alcohol) at 130 deg.C or below to obtain a polyimide having an imidation ratio of 30-80%. The polyimide is cooled to 80-90 deg.C, and aqueous ammonia is added thereto to obtain an aq. polyimide resin compsn. having a resin content of 5-70wt%. USE:Electrical insulating paint, film, adhesive, laminating material, impregrating agent for glass fiber, etc.
申请公布号 JPS61155448(A) 申请公布日期 1986.07.15
申请号 JP19840280587 申请日期 1984.12.27
申请人 NEW JAPAN CHEM CO LTD;KODO KEIUN 发明人 KIMURA YOSHIAKI;KAWASHIMA YUJI;KODO KEIUN
分类号 C08L79/08;C08K3/28 主分类号 C08L79/08
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