| 摘要 |
PURPOSE:To obtain a copper alloy for lead frame combining high strength with high electric conductivity, by adding specific amounts of Al and/or Si and Mn and/or Mg to a Cu-Ni-Ti alloy. CONSTITUTION:The copper alloy for lead frame has a composition containing, by weight, 0.8-4% Ni and 0.2-4% Ti so that Ni%/Ti%=1-4 is satisfied, further containing 0.05-1%, in total, of 0.1-1% Mn and/or 0.05-0.6% Mg and 0.005-0.5%, in total, of Al and/or Si, and having the balance Cu. |
