| 摘要 |
PURPOSE:To provide a tape carrier outer bonding too by which outer leads can be bonded to pads without forming solder bridges even if a pre-coating solder layer on the pad is uneven in thickness. CONSTITUTION:The electrodes of a semiconductor chip 2 are bonded to the inner leads of a tape carrier 3, and then the outer leads 35B of the tape carrier 3 are collectively bonded to the corresponding pads 12 arranged on a circuit board 1 by an outer bonding tool. The bonding tool concerned is provided with a frame-shaped pressing face 51 which spans the outer leads 35B disposed in a row, and a U-shaped groove 52 whose length is large enough to span the outer leads 35B and width is smaller than the length of the outer leads 35B by a required value is provided to the frame-shaped pressing face 51. |
