发明名称 PRINTED WIRING BOARD WITH SHIELD LAYER
摘要 <p>PURPOSE:To obtain an effective shield effect without impairing stability with the passage of time by printing and drying a ferrite containing polymer paste so as to cover a pattern of a printed wiring board made of a copper-clad laminated plate for forming a shield layer. CONSTITUTION:A resin insulated layer 3 having an epoxy main component is formed by printing, heating and drying while covering a signal pattern of a printed wiring board made by etching a copper-clad laminated plate, thereon a shield layer 4 is formed by printing, heating and drying ferrite past. Further thereon, paste same with that used for undercoating is printed so as to form the resin insulated layer 5. Ferrite-containing polymer paste has the paste-like constitution, where a binder and a high boiling point solvent are added to ferrite powder so as to give an aptitude for printing. Thereby, generation of needless radiation is reduced while being stable with the passage of time.</p>
申请公布号 JPH0276295(A) 申请公布日期 1990.03.15
申请号 JP19880227723 申请日期 1988.09.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 NISHIOKA KATSUNORI;TOKANE HIKOHIRO;IGAWA YOSHIO;WATANABE TAKAHIKO
分类号 H05K3/46;H05K9/00 主分类号 H05K3/46
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