| 摘要 |
PURPOSE:To perform mounting automatically in a small space with a solder and the like by one process by providing a through hole in the outer lead-out part of a thick film circuit board, and inserting a pint-shaped lead into the hole. CONSTITUTION:A through hole 6 that is a hole in the inner surface of which metallization is performed is provided at the lead-out part of an outer lead 2 of a thick film circuit board 1. A pin-shaped lead 2 having the suitable length is inserted into the hole, and at least the upper surface is soldered. When said board is assembled into a set, a cream solder 7 is applied at a part directly beneath a heat sink 3 of another board 5 to which the thick film circuit board 1 is attached and at a part where the outer lead 2 is located. When the device is made to move in a heated reflow furnace, the cream solder 7 is fused, and the heat sink 7 and the outer lead 2 are bonded with the solder. In this way, the automatic mounting can be performed in a small space, and the device can be attached to the set by one process such as reflow. |
