RESIN SEALING OF ELECTRONIC COMPONENT, MOLD FOR RESIN SEALING AND ELECTRONIC COMPONENT SEALING MOLDING

摘要

PURPOSE:To acquire a product with fewer defects such as position deviation or a fallen bonding wire by providing a step or a core to a part of a cavity and by controlling a position and a direction of development of resin flow or resin pressure during filling of resin. CONSTITUTION:A step 8 is formed to a female mold 4a of a sealing mold and a product is provided with a groove. Filling of resin to a part 10b of a cavity precedes, thereby making resin flow in from both directions to a lower side of a printed board as an arrow 9g performing supplement in the same way. That is, compression of resin in the lower side of the printed board delays to balance with compression of resin at an upper side of the printed board. A product with fewer defects such as position deviation and deformation of an electronic component to be sealed or a fallen bonding wire can be manufactured in this way.