Chipkartenmodul und diesen umfassende Chipkarte

摘要

The invention relates to a chip card module (1) comprising a semiconductor chip which contacts a metallic lead frame (2) having contact areas (3) in an electrically conductive manner. Both the semiconductor chip and contact areas (3) contact each other in an electrically conductive manner via connecting areas (5) which are arranged on the side (4) of an electrically isolating protective layer applied to the semiconductor chip which faces away from said semiconductor chip. The contacts between the connecting areas (5) and contact areas (3) can be made by solder joints (6) or electrically conductive glued joints. The invention further relates to a chip card (10) comprising the chip card module (1) described in the invention.