发明名称 |
Method and apparatus for continuous processing of semiconductor wafers |
摘要 |
An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.
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申请公布号 |
US5893966(A) |
申请公布日期 |
1999.04.13 |
申请号 |
US19970901601 |
申请日期 |
1997.07.28 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM, SALMAN;HEMBREE, DAVID R. |
分类号 |
C25D7/12;C25D17/00;C25F7/00;(IPC1-7):C25D7/12;C25D9/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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