发明名称 CONTAINER FOR ELECTRONIC COMPONENT ACCOMMODATION
摘要 <p>PROBLEM TO BE SOLVED: To provide an insulating container for electronic component accommodation which includes an insulating base and a lid member and which is able to airtightly seal an electronic component within the container, without causing deterioration in the characteristics of the electronic component, to thereby have the electronic component operate normally and stably for a long period of time. SOLUTION: This container for electronic component accommodation includes an insulating base 1 and a lid member 2. By having the lid 2 join with the base 1 through a sealing material 8 therebetween, an electronic component can be accommodated airtightly within the container. The sealing material 8 has a 3-layer structure, i.e., a first member 8a and second members 8b disposed on the upper and lower sides thereof. The first member 8a and a second member 8b contain 40-60 weight % of silver oxide, 20-30 weight % of phosphorus pentoxide and 1-6 weight % of zinc oxide as glass components, and also contains zirconium oxide and niobium oxide solid solution as fillers. The first member container 10-30 weight % of fillers, and the second member contains 31-50 weight % of the fillers.</p>
申请公布号 JPH11233665(A) 申请公布日期 1999.08.27
申请号 JP19980036403 申请日期 1998.02.18
申请人 KYOCERA CORP 发明人 ITO YOSHIAKI
分类号 C03C3/16;C03C8/24;H01L23/10;(IPC1-7):H01L23/10 主分类号 C03C3/16
代理机构 代理人
主权项
地址